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2026 CPES Conference - Technical Session

Technical Session 5: Packaging

5.1: Coaxial Medium-Voltage SiC MOSFET Power Module
Jack Knoll, Christina DiMarino
5.2: Warpage Evaluation of Double-Side Cooled Power Modules Using Ceramic Stiffeners
Tarik Teker, Narayanan Rajagopal, Christina DiMarino
5.3: Design and Prototyping of a 3.3 kV Double-Side Cooled SiC MOSFET Power Module with EMI and Field Grading Mitigation for Grid-Tied Systems
Andrew Zhang, Peiyuan Sun, Zachary Zintak, Joshua Gardner, GuoQuan Lu

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