INDUSTRY MEMBERS
2026 CPES Conference - Dialogue Session
Dialogue Session D3: Section 3
D3.1: Insulation and Field-Stress Considerations in Medium-Voltage Inductor Design
David Nam, Arthur Mendes, Ning Yan, Minh Ngo, Tim Thacker, Rolando Burgos
D3.2: Systematic Evaluation of Partial Discharge Phenomenon in Encapsulated Ceramic Substrates
Sreenath Krishnan
D3.3: Design Consideration for Minimizing Common Mode EMI Using Balancing Techniques
Qiuzhe Yang, Qiang Li
D3.4: Investigation of Packaging Techniques to Mitigate Electromagnetic Interference in Space-Rated Power Modules
Melanie Peck
D3.5: Selective Removal of Couplings in Multiwinding Magnetics
Promit Datta, Jumpei Niida, Khai D.T. Ngo
D3.6: Fabrication and Characterization of Amorphous n-Ga2O3/p-NiO Diodes
Matthew Porter
D3.7: Sync+ IP Family: Towards the Concept of Synchronization-Embedded Interface IP Design
Mingze Gao, Vladimir Mitrovic, Rolando Burgos, Babak Fahimi
D3.8: Hierarchical Distributed Digital Control of a Three-Phase ac-dc-ac 13.8 kV ac 22 kV dc Flying Capacitor-Based Power Conditioning System
Arthur Mendes, Vladimir Mitrovic, Mingze Gao, David Nam, Timothy Thacker, Dong Dong, Rolando Burgos
D3.9: Analytical Modeling of Parallel Open-Winding NeutralPoint-Clamped Converters
Mohammad Nair Aalam, Timothy Thacker, Rolando Burgos
D3.11: Virtual Synchronous Machine Controlled Solid-State Power Substation for Enhancing Renewable Hosting Capacity
Xinliang Yang, Biqi Wang, Rolando Burgos
D3.12: Effect of a Polymer Nanocomposite on Surface Flashover in Power Converters at High Elevation
Peiyuan Sun, Zachary Zintak, Quo-Quan Lu
D3.12: Chip-Proximity Electric Field Modelling and Reduction for Packaging Medium-Voltage SiC Power Modules
Peiyuan Sun, Zachary Zintak, Andrew Zhang, Guo-Quan Lu
D3.13: Design and Prototyping of a 3.3 kV Double-Side Cooled SiC MOSFET Power Module with EMI and Field Grading Mitigation for Grid-Tied Systems
Andrew Zhang, Peiyuan Sun, Zachary Zintak, Joshua Gardner, GuoQuan Lu
D3.13: Design and Packaging of a 1.2 kV Double-Side Cooled SiC MOSFET Power Module by Rapid and Low-Pressure Sintered-Silver Bonding
Andrew Zhang, Zachary Zintak, Peiyuan Sun, Joshua Gardner, Bin Li, Yingying He, Karsten Schmidt, Guo-Quan Lu
